By Rohit Sharma, Tapas Chakravarty
Compact versions and dimension strategies for High-Speed Interconnects presents distinctive research of matters concerning high-speed interconnects from the point of view of modeling methods and size suggestions. specific concentration is laid at the unified process (variational technique mixed with the transverse transmission line strategy) to enhance effective compact types for planar interconnects. This publication will supply a qualitative precis of many of the said modeling thoughts and techniques and may aid researchers and graduate scholars with deeper insights into interconnect types specifically and interconnect commonly. Time area and frequency area dimension strategies and simulation technique also are defined during this book.
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Extra info for Compact Models and Measurement Techniques for High-Speed Interconnects
20]) Geometric configuration Formula to obtain Green’s Differential equation c Is function h 2 À Á i np 1 np xo 2 P Electric wall at x = 0 and c d np 2 c Gn ðyÞ ¼ À ce2 dðy À yo Þ sin npcxo np sin c G¼ Gn ðyÞ sin npx dy2 À c c n¼1 2 ! 2 Unified Approach 25 26 Fig. 5 Lateral view of general microstrip-like interconnect structure. Ó 1982 IEEE reprinted, with permission, from Bhat and Koul  2 Compact Modeling of High-Speed Interconnects y b/2 y0 S Y+ w Yb/2 0 r x c Authors in [1, 14] have elaborated on the upper and lower bounds of this capacitance.
The set of equations given in Sect. 1 can now be used to compute inductance, impedance and delay constants. The method of computing admittance using the unified approach is efficient yet accurate. Comparison of the analytical results for capacitance and line impedance with 3D field solver and measurements shows good accuracy with less than 5% error. This is shown in Fig. 5. The absence of ground below the interconnect line can be attributed to a partly etched ground plane or a defected ground structure.
The modeling approach is very effective for CAD-based application and particularly suited for planar interconnect structures. The models do not use any inherent assumptions. The assumption of trial function f(x) is based on maximizing the capacitance that can give the closest value to exact solutions and is based on the charge distribution in the interconnect cross-section. In the above discussion an important insight is also obtained by applying the approach to both single and coupled lines. We observe that by inserting a ground trace between two parallel lines in proximity crosstalk is reduced, yet such proximity of ground trace to individual lines will change the characteristic impedance.