DRAM Circuit Design. Fundamental and High-Speed Topics by Brent Keeth, Visit Amazon's R. Jacob Baker Page, search

By Brent Keeth, Visit Amazon's R. Jacob Baker Page, search results, Learn about Author Central, R. Jacob Baker, , Brian Johnson, Feng Lin

A latest, finished creation to DRAM for college students and practising chip designers.Dynamic Random entry reminiscence (DRAM) know-how has been one of many greatestdriving forces within the development of solid-state know-how. With its skill to supply excessive product volumes and occasional pricing, it forces solid-state reminiscence brands to paintings aggressively to chop charges whereas retaining, if now not expanding, their marketplace percentage. accordingly, the state-of-the-art maintains to strengthen because of the large strain to get extra reminiscence chips from each one silicon wafer, basically via strategy scaling and smart layout.

Show description

Read Online or Download DRAM Circuit Design. Fundamental and High-Speed Topics PDF

Similar design books

The Art of Paper Cutting

<p class="MsoHeader" style="margin: 0in 0in 0pt">Papercutting is an historic, dependent artwork that dates virtually way back to the construction of paper itself. In today’s multicultural global, papercutting embraces any variety of issues, designs, and pictures. it really is an all-inclusive paintings that calls for few instruments and minimum fabrics.

Mikroprozessortechnik: Grundlagen, Architekturen, Schaltungstechnik und Betrieb von Mikroprozessoren und Mikrocontrollern

Das Buch Mikroprozessortechnik wendet sich an alle, die bei begrenzter Zeit einen leichten Einstieg in das Thema und einen Überblick über die wichtigsten Techniken suchen. So weit möglich, werden zu allen Themen zunächst die zu Grunde liegenden Ideen verständlich und plausibel gemacht; dabei wird großer Wert auf die Zusammenhänge gelegt.

Additional info for DRAM Circuit Design. Fundamental and High-Speed Topics

Sample text

Studies would be necessary to better understand the variability of the insulating capability of the insulation due to the many different environmental effects including fabrication variability and time of exposure to the space environment. 5cm B4C) + 4cm Be Total 74cm thickness Under calculated conduction area from Rx to shield and thermal flux into shield. Reference (p) has calculations with updated geometry. 200 - 300 W more heat conducts into shield. 5%. 4 kW. 9kW or more. Nealiaible: See Fiaure 5 ~r&nceptual shiGd is thicker, but IHG in aft section is'in~i~nificant compared to front.

Allowing stuck full-out sliders, per the nuclear design basis, would significantly increase shield mass (-190k25kg) for slider controlled reactor cases because shield radii would increase by about 4cml2cm in the 12"/6" directions, respectively. The relative shield mass differences between slider cases reported in References (s) and (t) would still be about the same since applying the one stuck full-out design basis criteria increases all slider case shield masses by about the same amount (k25kg) .

The hot and cold pipe surfaces refer to the heat transfer through the penetration surface(s) and are the total for the hot and cold pipe(s) respectively. 1kW of heat needs to be rejected per meter of hot leg piping in order to reduce the temperature of the piping outer wall to 900K (Reference (n)). 595m. 3kW and for piping routed around the shield could be 2 - 4 kW. 3 kW. From this, it can be concluded that an additional heat rejection path would most likely be required in order to maintain the section of hot leg piping within the shield less than 900K.

Download PDF sample

Rated 4.73 of 5 – based on 26 votes